Tin paste application using screen printing is a process used for applying hot melt material to printed circuit boards (PCBs) before soldering components. This procedure ensures that the paste is applied evenly and accurately to specific areas of the PCB, which is essential for high-quality and reliable soldering of components.
For tin paste application, we use 2 screen printing machines Speedprint SP700, EUROPLACER EP710 and jet printer MYDATA MY700. We check the applied paste using an SPI CyberOptics SE500ultra. It is important that the entire process is carried out with care and precision to ensure the quality and reliability of soldering on the PCB.
Choosing the right tin paste application equipment is a key factor in achieving high quality in industrial electronics manufacturing. MYDATA MY700 provides several benefits that can contribute to optimizing the production process and improving the overall result:
Accuracy and repeatability: the MYDATA MY700 is designed to achieve high accuracy in tin paste application, ensuring consistent quality and repeat production.
Flexibility: the machine is able to handle different sizes and types of PCBs, which is important for the flexibility of the manufacturing process.
Speed: MYDATA MY700 offers a high application speed, which increases overall manufacturing productivity.
Low level of waste: By accurately dosing the tin paste, waste is reduced, leading to cost savings and improved sustainability.
Integration with other technologies: MYDATA MY700 can be integrated with other machines and systems within the SMT line, ensuring a smooth and efficient production process.
Advanced features: The machine offers advanced features such as automatic calibration, error detection and adjustment options, allowing the tin paste application process to be optimized.
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