Testing of assembled PCBs is a key phase in electronics manufacturing, ensuring product quality and reliability. We use visual inspection, AOI (Automated Optical Inspection), functional testing, and X-ray inspection to guarantee that every product meets the highest standards.
Our processes detect and correct potential defects, minimize the risk of errors, and improve overall product reliability. We are certified according to ISO 9001 and ISO 14001 standards.
The first step involves a visual inspection, during which a technician examines the PCB for visible defects such as missing components, incorrect placement, damaged solder joints, or other physical irregularities.
This method uses high-resolution cameras and advanced software to automatically inspect the PCB based on defined parameters such as component placement, polarity, orientation, and solder joint quality.
At MARPOS, we use AOI SAKI 3Di-LS2 for precise and reliable inspection results.
Functional testing verifies whether the product operates correctly. The assembled PCB is connected to a test fixture that simulates real operating conditions, ensuring that all system functions perform as intended.
X-ray inspection allows visualization of the internal structure of the PCB, making it possible to detect defects such as missing components, solder voids, shorts, or other hidden issues that could lead to product malfunction or reduced reliability.
By combining these inspection methods, we ensure the highest level of quality and reliability. Testing of assembled PCBs is essential for maintaining consistent standards in modern electronics manufacturing.
Each component used in the assembly of a printed circuit board had a unique identification number. This number is recorded in the ERP database and is assigned to a specific printed circuit board.
Each step in the PCB assembly process is recorded and assigned to a specific product. This includes information about when the component was fitted, who fitted it, what device was used.
Information about testing and quality control processes is also part of traceability. This makes it possible to identify products with defects and track how these defects have been repaired.
If a problem with a printed circuit board occurs later, traceability allows it to be tracked. This means that you can identify all printed circuits that have been manufactured using the same components or processes and take the necessary steps to improve quality.
In some industries, such as healthcare or aviation, strict standards and regulations regarding traceability are required. This is to ensure the safety and quality of the products.
Overall, traceability in PCB assembly helps to increase product quality, reduce the risk of errors, and makes it easier to track the manufacturing process from start to finish. We manage this traceability with software systems that allow for easy monitoring and management of data.
At the customer's request, we provide an FAI report during primary production. The First Article Inspection Report (FAIR) is a documentation process used in the electronics and printed circuit board (PCB) industries, especially in the production of electronic devices. This process aims to ensure that the first batch of products meets the customer's specifications and requirements, and that the production process is well set up.
FAIR typically involves the following steps:
1. Gaining documentation
2. Sampling
3. Product Inspection
4. Dealing with identified deficiencies
5. FAIR Report
6. Customer approval
FAIR is an important step in the quality assurance process of electronic components and devices. It helps identify and resolve issues in the early stages of production, which can significantly reduce the cost of corrections later in the manufacturing process. In addition, FAIR helps to ensure that the products meet the customer's requirements and are safe and reliable.
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